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China Zhong Sen International Co.,Ltd |
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>>1.Rigid PCB Production Capability ---->>FPC
| No. |
Item |
standard capabilities |
Specialized capabilities |
| 1 |
Layers |
1 ～ 16 |
1 ～ 22 |
| 2 |
Board Final Thickness |
S/D sided board |
0.5 ～ 3.0 ㎜ |
0.2 ～ 4.0 ㎜ |
| Multi-layers board |
0.8 ～ 3.5mm |
0.4 ～ 6.0mm |
| 3 |
Copper Thickness |
18μm ， 35μm ， 70μm |
≤ 0.5mm |
| 4 |
Base Material |
FR-4 ， high Tg FR-4,CEM-3,PTFE(Rogers,Getek,Nelco), aluminum base ， ceramic base ， composite base |
| 5 |
Surface Finish |
HASL,OSP, Immersion Tin, Immersion Silver, Immersion Gold, Electrolytic Gold, Gold fingers |
| 6 |
Specialized Technology |
Blind/buried Hole PCB, ( 12oz )heavy Cu PCB, Impedance control PCB, high frequency PCB |
| 7 |
Max. Board Dimension |
single-sided PCB |
550× 700mm |
550× 2000mm |
| double-sided PCB |
550× 700mm |
550× 1000mm |
| multi-layers PCB |
550× 700mm |
550× 1000mm |
| 8 |
Min. Line Width/Space |
≥ 0.127mm (5mils) |
0.10mm (4mils) |
| 9 |
Min. Drilling Diameter |
≥ 0.40mm (16mils) |
0.20mm (8mils) |
| 10 |
Min. Annular Ring |
Component hole |
≥ 0.127mm （ 5mils ） |
0.10mm （ 4mils ） |
| Via hole |
≥ 0.10mm （ 4mils ） |
0.076mm （ 3mils ） |
| 11 |
Max. Aspect Ratio |
8:1 |
12:1 |
| 12 |
Min. Isolation Ring width |
≥ 0.30mm （ 12mils ） |
0.25mm （ 10mils ） |
| 13 |
Hole Size Tolerance (PTH) |
φ≤0.8( ㎜ ) |
± 0.076mm |
| 0.8 ＜ φ ＜ 1.6( ㎜ ) |
± 0.10mm |
| φ≥1.6( ㎜ ) |
± 0.15mm |
| Press fit Hole |
± 0.05mm |
| 14 |
Hole Position Tolerance |
± 0.05mm |
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| 15 |
Dimension Tolerance |
± 0.15mm |
± 0.10mm |
| 16 |
Min. Solder Bridge |
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0.10mm (4mils) |
| 17 |
Warp and Twist |
≤1.5% for NO SMT / 0.75% for SMT |
| 18 |
Peel Strength |
≥0.87N/mm |
| 19 |
Heat Shock |
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288℃ ± 5℃ ,after 10 seconds of immersion in the tin, the plating layer of in-hole is smooth, no crack, no separation. |
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| 20 |
Flammability |
94V-0 |
| 21 |
E-test Voltage |
50 ～ 250V |
| 22 |
Insulation Resistance |
＞ 500M Ω |
| 23 |
Impedance control |
±10 ％ |
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