No. |
Item |
Parameters |
1 |
material |
PolyimidePolyester |
2 |
Layer Counts |
1-6L |
|
Min Line Width/Space |
3/3mil |
3 |
Max Board size |
500*500mm |
4 |
Drilling diameter |
0.25mm-6.5mm |
5 |
Base material copper thickness |
12um-70um |
6 |
Insulate layer thickness |
0.0125-0.05mm (PI thickness) |
7 |
Electronic plating Sn/Pb thickness |
3m --- 20m |
8 |
Electronic plating Au thickness |
0.05m |
9 |
Chemical immersion Ni/Au thickness |
0.05m --- 0.1m |
10 |
Electronic plating Sn thickness |
3m --- 20m |
11 |
Etching width/space |
S: 3.5mil (0.076mm),DFM: 4.5mil (0.100mm) |
12 |
Etching tolerance |
width 20 (special 10) |
13 |
Board Outline tolerance |
0.1mm, 0.05mmthe same mould |
14 |
Parts fixed position tolerance |
0.2mm |
15 |
Insulation Resistance |
1011Normal |
16 |
Thermal Shock Resistance |
26010 seconds |
17 |
Peel Off Strength |
>1.0N/mm |
18 |
Inspection Standard |
IPC-A-600F |
